JPH0247088U - - Google Patents
Info
- Publication number
- JPH0247088U JPH0247088U JP12645288U JP12645288U JPH0247088U JP H0247088 U JPH0247088 U JP H0247088U JP 12645288 U JP12645288 U JP 12645288U JP 12645288 U JP12645288 U JP 12645288U JP H0247088 U JPH0247088 U JP H0247088U
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- multilayer printed
- sectional
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12645288U JPH0247088U (en]) | 1988-09-27 | 1988-09-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12645288U JPH0247088U (en]) | 1988-09-27 | 1988-09-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0247088U true JPH0247088U (en]) | 1990-03-30 |
Family
ID=31377991
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12645288U Pending JPH0247088U (en]) | 1988-09-27 | 1988-09-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0247088U (en]) |
-
1988
- 1988-09-27 JP JP12645288U patent/JPH0247088U/ja active Pending